Renesas Electronics

Summer 2026 Internship - May 26 - August 14Must not have graduated before September 2026We are seeking an experienced and highly motivated Applications Engineering Intern to join our team focusing on DDR5 this role you will play a critical part in driving the validation implementatio

Summer 2026 Internship - May 26 - August 14Must not have graduated before September 2026We are seeking an experienced and highly motivated Applications Engineering Intern to join our team focusing on DDR5 this role you will play a critical part in driving the validation implementatio

ENTRY LEVEL - A recent bachelor degree in Business Marketing Supply Chain or related field with no experience.Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this po

ENTRY LEVEL - A recent bachelor degree in Business Marketing Supply Chain or related field with no experience.Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this po

Summer 2026 Internship - May 26 - August 14Bridgewater NJ - 100% onsiteMust be currently enrolled full time in a university degree program pursing a bachelor or master degree.  Must not have graduated before September 2026.We are hiring a Field Applications Engineer Intern.  This qual

Summer 2026 Internship - May 26 - August 14Bridgewater NJ - 100% onsiteMust be currently enrolled full time in a university degree program pursing a bachelor or master degree.  Must not have graduated before September 2026.We are hiring a Field Applications Engineer Intern.  This qual

Summer 2026 Internship - Currently enrolled in MS or PhD EE program.  Must not have graduated before September 2026May 26 - August 14  (willing to entertain candidates who can start earlier even if part time)Hybrid - San JoseThis position is in CMSD which is part of Renesas Analog & C

Summer 2026 Internship - Currently enrolled in MS or PhD EE program.  Must not have graduated before September 2026May 26 - August 14  (willing to entertain candidates who can start earlier even if part time)Hybrid - San JoseThis position is in CMSD which is part of Renesas Analog & C

2026 Summer Intern (Must not have graduated before September 2026)May 26 - August 14San Jose CA - 100% onsiteRenesas MID (Memory Interface Division) is looking for an Analog intern to help the group on the development of the next generation DDR PMIC.During the time of the intern he/sh

2026 Summer Intern (Must not have graduated before September 2026)May 26 - August 14San Jose CA - 100% onsiteRenesas MID (Memory Interface Division) is looking for an Analog intern to help the group on the development of the next generation DDR PMIC.During the time of the intern he/sh

Role OverviewThis role owns the strategy and delivery of Renesas Hardware Support Packages spanning MBD platforms middleware foundation and peripheral enablement.The position blends technical leadership execution excellence and governance to scale highquality MBD solutions aligned wit

Role OverviewThis role owns the strategy and delivery of Renesas Hardware Support Packages spanning MBD platforms middleware foundation and peripheral enablement.The position blends technical leadership execution excellence and governance to scale highquality MBD solutions aligned wit

Experience: A minimum of 8 years in state-of-the-art verification methodologies specifically in the verification of IP/SoCs. Due to the complexity of our designs .Complex Design Adaptability: The candidate must quickly adapt and understand complex environments with minimal guidance fr

Experience: A minimum of 8 years in state-of-the-art verification methodologies specifically in the verification of IP/SoCs. Due to the complexity of our designs .Complex Design Adaptability: The candidate must quickly adapt and understand complex environments with minimal guidance fr

Role OverviewThe Peripheral & Variant Lead is the technical leader for peripheral blocksets and device variant scaling within Renesas Hardware Support Packages. This role delivers highquality Simulink peripheral blocks (e.g. ADC PWM UART CAN) using the foundation layer and drives scal

Role OverviewThe Peripheral & Variant Lead is the technical leader for peripheral blocksets and device variant scaling within Renesas Hardware Support Packages. This role delivers highquality Simulink peripheral blocks (e.g. ADC PWM UART CAN) using the foundation layer and drives scal

Job Purpose & DimensionsGiven the organic growth of our enterprise we do have the need to establish a central pool of tools with a standardized way of using them in development in order to assure development excellence a high standard of quality and reuse across our SW assets and inve

Job Purpose & DimensionsGiven the organic growth of our enterprise we do have the need to establish a central pool of tools with a standardized way of using them in development in order to assure development excellence a high standard of quality and reuse across our SW assets and inve

Job Purpose & DimensionsGiven the organic growth of our enterprise we do have the need to establish a central pool of tools with a standardized way of using them in development in order to assure development excellence a high standard of quality and reuse across our SW assets and inve

Job Purpose & DimensionsGiven the organic growth of our enterprise we do have the need to establish a central pool of tools with a standardized way of using them in development in order to assure development excellence a high standard of quality and reuse across our SW assets and inve

Responsible for performing failure analysis on semiconductor devices related to assembly processes. Identify root causes of electrical and physical failures support yield improvement and drive improvement to enhance product quality reliability and customer satisfaction. Key Responsibi

Responsible for performing failure analysis on semiconductor devices related to assembly processes. Identify root causes of electrical and physical failures support yield improvement and drive improvement to enhance product quality reliability and customer satisfaction. Key Responsibi

Summer 2026 Internship - May 26 - August 14Must be currently enrolled full time in a university degree program pursing a bachelors or masters degree.  Must not have graduated before September 2026 and not after May 2027.Duluth GA - hybridRenesas is looking for a talented student to jo

Summer 2026 Internship - May 26 - August 14Must be currently enrolled full time in a university degree program pursing a bachelors or masters degree.  Must not have graduated before September 2026 and not after May 2027.Duluth GA - hybridRenesas is looking for a talented student to jo

Summer 2026 Internship - May 26 - August 14Bridgewater NJ - 100% onsiteMust be currently enrolled full time in a university degree program pursing a bachelor or master degree.  Must not have graduated before September 2026.We are hiring a Field Applications Engineer Intern.  This qual

Summer 2026 Internship - May 26 - August 14Bridgewater NJ - 100% onsiteMust be currently enrolled full time in a university degree program pursing a bachelor or master degree.  Must not have graduated before September 2026.We are hiring a Field Applications Engineer Intern.  This qual

We are seeking a highly motivated and experienced SoC Design Verification Engineer to join our this role you will lead and contribute to the verification of complex System-on-Chip (SoC) designs ensuring functionality performance and quality meet project and customer specifications. T

We are seeking a highly motivated and experienced SoC Design Verification Engineer to join our this role you will lead and contribute to the verification of complex System-on-Chip (SoC) designs ensuring functionality performance and quality meet project and customer specifications. T

募集背景当社では次世代パッケージ技術Flip ChipSiP などの開発を中心に半導体後工程における技術革新を積極的に推進しています特に AI高性能コンピューティングHPC車載IoT 分野においてはより高密度高信頼性高放熱性を備えたパッケージ技術が求められておりFCCSPFlip Chip Chip Scale Packageや FCBGA といった先端技術の開発が加速しています今後デバイスの複雑化や多機能化がさらに進む中技術領域の拡大と開発体制の強化が不可欠となっていますこうした背景から当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集いたしま

募集背景当社では次世代パッケージ技術Flip ChipSiP などの開発を中心に半導体後工程における技術革新を積極的に推進しています特に AI高性能コンピューティングHPC車載IoT 分野においてはより高密度高信頼性高放熱性を備えたパッケージ技術が求められておりFCCSPFlip Chip Chip Scale Packageや FCBGA といった先端技術の開発が加速しています今後デバイスの複雑化や多機能化がさらに進む中技術領域の拡大と開発体制の強化が不可欠となっていますこうした背景から当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集いたしま

We are looking for a highly motivated Intern/ Working Student who will join our team as a Hardware Test Engineering Intern in Lviv office.The role:Design and develop electronic hardware from concept to productionCreate and maintain customer-facing and internal technical documentationP

We are looking for a highly motivated Intern/ Working Student who will join our team as a Hardware Test Engineering Intern in Lviv office.The role:Design and develop electronic hardware from concept to productionCreate and maintain customer-facing and internal technical documentationP

Job SummaryLeads the design development and governance of automation platforms to improve speed quality reliability and cost efficiency while aligning automation initiatives with global strategiesKey ResponsibilitiesIdentify opportunities for automation digitalization and smart manufa

Job SummaryLeads the design development and governance of automation platforms to improve speed quality reliability and cost efficiency while aligning automation initiatives with global strategiesKey ResponsibilitiesIdentify opportunities for automation digitalization and smart manufa

About the RoleWe are looking for an experienced and visionary Functional Safety Architect to define drive and govern functional safety concepts for next-generation industrial this role you will lead system-level safety architecture across hardware software and system boundaries ensur

About the RoleWe are looking for an experienced and visionary Functional Safety Architect to define drive and govern functional safety concepts for next-generation industrial this role you will lead system-level safety architecture across hardware software and system boundaries ensur

About the RoleWe are looking for an experienced and visionary Functional Safety Architect to define drive and govern functional safety concepts for next-generation industrial this role you will lead system-level safety architecture across hardware software and system boundaries ensur

About the RoleWe are looking for an experienced and visionary Functional Safety Architect to define drive and govern functional safety concepts for next-generation industrial this role you will lead system-level safety architecture across hardware software and system boundaries ensur

Job Purpose and Dimensions:Develop qualify validate design-in and support next-generation IC products for applications such as Opamp interface and Isolation chip.Principal Accountabilities: Design debug and test new products and support old products.Use different kinds of design tools

Job Purpose and Dimensions:Develop qualify validate design-in and support next-generation IC products for applications such as Opamp interface and Isolation chip.Principal Accountabilities: Design debug and test new products and support old products.Use different kinds of design tools